Reballing Stencil EMMC EMCP UFS BGA162 BGA186 BGA254 BGA221 BGA153 BGA169
USD 19.25 USD
Specifications
| Country Of Origin | China |
| Brand | Amaoe |
| Item Type | Stencil |
EMMC EMCP UFS UMCP LPDDR PCIE Stencil. AMAOE EMMC BGA Reballing Stencil For Android Nand Flash EMMC UFS LPDDR PCIE 153 162 169 221 254 Phone Motherboard Repair Stencil. 1x iPhone 14 Stencil. From 3D printing and design to component level repair parts and soldering solutions.